Silent – 2 mm (Fine)
Silicone Carbide Abrasive (SiC) For finest grinding of ceramics and metal alloys.Ā Magnesite bond, Unmounted. Centre hole Ć 1.8 mm
Silent – 3 mm (Fine)
Silicone Carbide Abrasive (SiC) For heatless and dry grinding of ceramics and metal alloys.Ā Magnesite bond, Unmounted.Ā Centre hole Ć 1.8 mm
Heatless – 2 mm (Medium)
Silicone Carbide Abrasive (SiC) For heatless and dry grinding of ceramics and metal alloys. Magnesite bond, Unmounted.Ā Centre hole Ć 1.8 mm
Heatless – 3 mm (Medium)
Silicone Carbide Abrasive (SiC) For heatless and dry grinding of ceramics and metal alloys.Ā Magnesite bond, Unmounted.Ā Centre hole Ć 1.8 mm
BHA782Ā BSA766SĀ BSA772SĀ BSA767SĀ BSA762SĀ BHA776Ā BHA766Ā BHA761Ā BHA772Ā BHA767Ā BHA762




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