Silent – 2 mm (Fine)
Silicone Carbide Abrasive (SiC) For finest grinding of ceramics and metal alloys. Magnesite bond, Unmounted. Centre hole Ø 1.8 mm
Silent – 3 mm (Fine)
Silicone Carbide Abrasive (SiC) For heatless and dry grinding of ceramics and metal alloys. Magnesite bond, Unmounted. Centre hole Ø 1.8 mm
Heatless – 2 mm (Medium)
Silicone Carbide Abrasive (SiC) For heatless and dry grinding of ceramics and metal alloys. Magnesite bond, Unmounted. Centre hole Ø 1.8 mm
Heatless – 3 mm (Medium)
Silicone Carbide Abrasive (SiC) For heatless and dry grinding of ceramics and metal alloys. Magnesite bond, Unmounted. Centre hole Ø 1.8 mm
BHA782 BSA766S BSA772S BSA767S BSA762S BHA776 BHA766 BHA761 BHA772 BHA767 BHA762




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